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ISL29027
Typical Circuit
A typical application for the ISL29027 is shown in Figure 6. The
ISL29027’s I 2 C address is internally hardwired as 0b100010<x>,
with x representing the logic state of input I 2 C address pin
ADDR0. The device can be tied onto a system’s I 2 C bus together
with other I 2 C compliant devices.
Soldering Considerations
Convection heating is recommended for reflow soldering; direct-
infrared heating is not recommended. The plastic ODFN package
does not require a custom reflow soldering profile, and is qualified to
+260°C. A standard reflow soldering profile with a +260°C
maximum is recommended.
Suggested PCB Footprint
It is important that users check the “Surface Mount Assembly
Guidelines for Optical Dual FlatPack No Lead (ODFN) Package”
before starting ODFN product board mounting.
http://www.intersil.com/data/tb/TB477.pdf
Layout Considerations
The ISL29027 is relatively insensitive to layout. Like other I2C
devices, it is intended to provide excellent performance even in
significantly noisy environments. There are only a few
considerations that will ensure best performance.
Route the supply and I 2 C traces as far as possible from all
sources of noise. 0.1μF and 1μF power supply decoupling
capacitors need to be placed close to the device.
V I2C_PULL-UP
R1
10k ?
R2
10k ?
R3
10k ?
I 2 C MASTER
MICROCONTROLLER
V DD
SLAVE_0
V IR-LED
SLAVE_1
I 2 C SLAVE_n
INT
SDA
SCL
1 ADDR0 IRDR 8
SDA
SDA
GND
C1
1μF
C2
0.1μF
2 VDD
3
INT
SDA
7
6
SCL
SCL
4
REXT
SCL
5
REXT
499k ?
ISL29027
FIGURE 6. ISL29027 TYPICAL CIRCUIT
9
FN7815.1
February 2, 2012
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